ELECTRO COPPER PLATING ADDITIVE AND ELECTRO COPPER PLATING BATH
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United States of America Patent
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Issued Date -
Dec 26, 2013
app pub date -
Mar 23, 2012
filing date -
Mar 28, 2011
priority date (Note) -
Abandoned
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Abstract
Provided are an additive for electro copper plating and an electro copper plating bath containing the additive, wherein the additive forms a plating film uniformly in a range of from a low current density portion to a high current density portion and thereby gives good glossiness, and is not consumed at the time of non-usage thereof. In the present invention, an additive for electro copper plating including a block polymer compound expressed by the following general formula (1) is added to an electro copper plating bath. (Here, in the formula, R represents an alkyl group or an alkenyl group having a linear-chain or branched-chain structure and having a carbon number of 1 to 15, m is an integer of from 1 to 30, and n is an integer of from 1 to 40.)
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