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United States of America Patent
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Issued Date -
Dec 26, 2013
app pub date -
Jun 13, 2013
filing date -
Jun 20, 2012
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
This disclosure relates a system and techniques for adjusting component parts of a Plasma-enhanced processing system. The electric field uniformity generated by plasma processing may be improved by adjusting the distance between a cavity of an upper electrode and an insulating plate that covers, at least a portion of, the cavity. In another embodiment, the electric field uniformity may be improved by adjusting the distance between the substrate and the upper electrode.
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