VAPORIZATION SOURCE, VAPORIZATION CHAMBER, COATING METHOD AND NOZZLE PLATE
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United States of America Patent
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app pub date -
May 17, 2013
filing date -
Dec 21, 2010
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Abstract
The invention relates to vaporization source, an evaporation chamber, a coating method and a nozzle plate. The vaporization source according to the invention makes it possible to generate a high, stable melt flow rate having improved layer thickness homogeneity under vacuum conditions in a selenium atmosphere. The direction of the molecular flow of the vaporization source can be adjusted with respect to the substrate support located above the vaporization source.
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