SOLDER PASTE DROPLET EJECTION APPARATUS, PATTERNING SYSTEM HAVING THE SAME, AND CONTROL METHOD THEREOF
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United States of America Patent
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Issued Date -
Dec 19, 2013
app pub date -
Aug 22, 2012
filing date -
Jun 18, 2012
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
Disclosed herein is a solder paste droplet ejection apparatus including: a nozzle cap forming an appearance and including a heating electric wire provided inside thereof; a nozzle unit formed inside the nozzle cap, spaced apart from the nozzle cap, and surrounded by the nozzle cap; an ejection probe formed inside the nozzle unit, spaced apart from the nozzle unit, and surrounded by the nozzle unit; and a transfer unit formed in a top portion of the nozzle cap and used for a minute movement, wherein a solder paste supplied in a space between the nozzle unit and the ejection probe is ejected in a droplet shape along the ejection probe.
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