FLUX
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United States of America Patent
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N/A
Issued Date -
Dec 19, 2013
app pub date -
Feb 28, 2012
filing date -
Mar 2, 2011
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
To provide flux which has a property of suppression of sedimentation of the solder powder, dissolves by heating at the time of the soldering to remain no residue and does not block any wettability of the solder.
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