ORGANIC THIN FILM FORMING APPARATUS

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United States of America Patent

SERIAL NO

13912425

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Abstract

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An organic thin film forming apparatus that can easily remove an organic thin film adhered to a surface of a deposition preventive plate. The apparatus forms an organic thin film on a substrate disposed on a surface of a substrate stage from an organic gas. An electroless nickel film containing fluorine resin is formed on the surface of a deposition preventive plate. The electroless nickel film containing fluorine resin has mold release characteristics for an organic thin film. Even if the organic thin film adheres, the organic thin film can be easily removed by a method (such as, high pressure cleaning).

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Patent Owner(s)

Patent OwnerAddress
ULVAC INCKANAGAWA JAPAN KANAGAWA

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
MIYAUCHI, Jun Chigasaki-shi, JP 5 552
OMORI, Daisuke Tsukuba-shi, JP 13 476
UCHIDA, Kazuya Tsukuba-shi, JP 22 467

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