INTEGRATED CIRCUIT PACKAGING SYSTEM WITH FILM ASSIST AND METHOD OF MANUFACTURE THEREOF
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United States of America Patent
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Issued Date -
Dec 12, 2013
app pub date -
Jun 12, 2012
filing date -
Jun 12, 2012
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Abstract
A method of manufacture of an integrated circuit packaging system includes: providing a substrate; forming an integrated circuit device having a shaped side; mounting the integrated circuit device on the substrate; forming an encapsulation on the substrate and the integrate circuit device with the shaped side partially exposed from the encapsulation.
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