LED MODULE

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United States of America Patent

APP PUB NO 20130328067A1
SERIAL NO

13623499

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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An LED module includes a silicone substrate, an LED grain mounted on a face of the silicone substrate, a temperature sensor formed under the LED grain, a luminous sensor formed close to the LED grain and an encapsulation gel enclosing the LED grain, wherein the LED grain, the luminous sensor and the temperature sensor are electrically connected to electrodes for connection to foreign devices.

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Patent Owner(s)

Patent OwnerAddress
FENG CHIA UNIVERSITYNO 100 WENHUA RD XITUN DIST TAICHUNG CITY 40724

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chang, Sheng-Wei Seatwen Taichung, TW 2 8
Huang, Cheng-Han Seatwen Taichung, TW 32 470
Tseng, Kuo-Chun Seatwen Taichung, TW 1 8
TSOU, Ching-fu Seatwen Taichung, TW 4 34

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