SUBSTRATE-BASED INDUCTIVE DEVICES AND METHODS OF USING AND MANUFACTURING THE SAME
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United States of America Patent
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Issued Date -
Dec 5, 2013
app pub date -
May 21, 2013
filing date -
May 22, 2012
priority date (Note) -
Abandoned
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Abstract
Low-cost and high-precision inductive devices and methods of manufacturing and using the same. In one embodiment, the inductive device comprises a substrate-based inductive device which utilizes inserted conductive pins in combination with plated substrates which replace windings disposed around a magnetically permeable core. In some variations, these substrate-based inductive devices are integrated into a discrete electronic device. In another embodiment, the substrate-based inductive devices are incorporated into integrated connector modules. Methods of manufacturing and utilizing the aforementioned discrete substrate-based inductive devices and substrate-based integrated connector modules are also disclosed.
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