THIN MEMS MICROPHONE MODULE
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United States of America Patent
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Issued Date -
Dec 5, 2013
app pub date -
May 30, 2012
filing date -
May 30, 2012
priority date (Note) -
Abandoned
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Abstract
A MEMS microphone module includes a first circuit board and a second circuit board attached to the first circuit board. A MEMS chip and an ASIC chip are respectively received in one of two concavities of the first circuit board. A first ground layer of the first circuit board and a second ground layer of the second circuit board are electrically coupled to each other to define a ground shielding structure. By this way, an EMI shielding can be applied by the ground shielding structure to the MEMS chip and the ASIC chip.
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