Double-Layer Circuit Structure with High Heat-Dissipation Efficiency
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United States of America Patent
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Issued Date -
Dec 5, 2013
app pub date -
May 9, 2013
filing date -
Jun 1, 2012
priority date (Note) -
Abandoned
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Abstract
The present invention relates to a double-layer circuit structure with high heat-dissipation efficiency, comprising: a first thermal-conductive and electric-insulating layer, a plurality of first metal pads, a second thermal-conductive and electric-insulating layer, a circuit layer, and an anti-soldering layer. In the double-layer circuit structure, the second thermal-conductive and electric-insulating layer disposed on the first thermal-conductive and electric-insulating layer has a plurality of openings, and a plurality of second metal pads of the circuit layer on the second thermal-conductive and electric-insulating layer are connected with the openings, respectively. Thus, after each of devices to be welded are soldered on two second metal pads, the solder would flow into the openings through the soldering points between the devices to be welded and the second metal pads, so as to sequentially flow onto the first metal pads. Therefore, the flow path of the solder becomes a heat-dissipating shortcut for heat dissipation.
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