SPUTTERING PROCESS
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United States of America Patent
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Issued Date -
Dec 5, 2013
app pub date -
May 30, 2013
filing date -
Jun 1, 2012
priority date (Note) -
Abandoned
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Abstract
In a process for coating a substrate, the substrate is arranged opposite a removal surface of a target and the coating material is atomized by sputtering under an inert or reactive-gas-containing process gas and deposited on the substrate. The coating takes place from a mixed target with at least one target component A and a target component B. At the beginning of the sputtering process, the distribution of the target components A and B in a superficial target layer of the removal surface is modified by high-power impulse magnetron sputtering.
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