PRINTED CIRCUIT BOARD OF SEMICONDUCTOR PACKAGE FOR DECREASING NOISE BY ELECTROMAGNETIC INTERFERENCE
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United States of America Patent
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Issued Date -
Dec 5, 2013
app pub date -
Mar 18, 2013
filing date -
May 30, 2012
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A printed circuit board for a semiconductor package which is capable of reducing noise by electromagnetic interference (EMI), including: an upper circuit layer in which a first circuit pattern is formed; an intermediate circuit layer that is disposed below the upper circuit layer and has a second circuit pattern formed therein; a lower circuit layer that is disposed below the intermediate circuit layer and has a third circuit pattern formed therein; an insulating layer disposed between the first and second circuit patterns and between the second and third circuit patterns; vias that vertically connect the first, second and third circuit patterns; and EMI blocking vias that are arranged along edge portions of the first, second and third circuit patterns and are connected to a ground layer.
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