METHOD AND APPARATUS FOR PROCESSING WAFER-SHAPED ARTICLES
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United States of America Patent
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Issued Date -
Dec 5, 2013
app pub date -
Jun 4, 2012
filing date -
Jun 4, 2012
priority date (Note) -
Abandoned
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Abstract
A device and method for treating the surface of a semiconductor wafer provides a treatment fluid in the form of a dispersion of gas bubbles in a treatment liquid generated at acoustic pressures less than those required to induce cavitation in the treatment liquid. A resonator supplies ultrasonic or megasonic energy to the treatment fluid and is configured to create an interference pattern in the treatment fluid comprising regions of pressure amplitude minima and maxima at an interface of the treatment fluid and the semiconductor wafer. The resonator is mounted in the space between the rotary chuck body and a wafer carried in rotation with the chuck body; however, the resonator itself is stationary in relation to rotation of the wafer and chuck body.
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