ULTRA-THIN NEAR-HERMETIC PACKAGE BASED ON RAINIER
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United States of America Patent
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app pub date -
Jul 31, 2013
filing date -
May 11, 2007
priority date (Note) -
Abandoned
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Abstract
A microelectronic package including a dielectric layer having top and bottom surfaces, the dielectric layer having terminals exposed at the bottom surface; a metallic wall bonded to the dielectric layer and projecting upwardly from the top surface of the dielectric layer and surrounding a region of the top surface; a metallic lid bonded to the wall and extending over the region of the top surface so that the lid, the wall and the dielectric layer cooperatively define an enclosed space; and a microelectronic element disposed within the space and electrically connected to the terminals.
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