Resin Composition for Flexible Printed Circuit Board
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United States of America Patent
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Issued Date -
Nov 28, 2013
app pub date -
May 28, 2013
filing date -
May 28, 2012
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Abstract
A resin composition for a flexible printed circuit board that can attain high adhesiveness and solder reflow resistance even if a base film having low dielectric properties is used, and that attains excellent electrical properties. The resin comprises a fluororesin and an isocyanate compound, wherein the fluororesin has a content of 1 to 50% by mass, and a hydroxyl equivalent of 300 to 5500 g/equivalent.
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