METHOD OF MODIFYING A BOUNDARY REGION OF A SUBSTRATE
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United States of America Patent
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Nov 28, 2013
app pub date -
May 21, 2013
filing date -
May 24, 2012
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Abstract
A method of modifying a boundary region (9) of a substrate (3) bounded by a surface (10), wherein an evacuated process chamber (2) is provided having a plasma source (4) for generating a directed plasma jet (5), and wherein furthermore a reactive component is supplied into the process chamber (2) with a flow of a predefined size, and wherein the substrate (3) is heated to a predefined reaction temperature, characterized in that the reactive component is diffusion-activated by the directed plasma jet (5) such that the reactive component diffuses into the boundary region (11) of the substrate (3) at a predefinable diffusion rate.
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