METHOD AND APPARATUS FOR LIQUID TREATMENT OF WAFER-SHAPED ARTICLES
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United States of America Patent
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Issued Date -
Nov 21, 2013
app pub date -
May 15, 2012
filing date -
May 15, 2012
priority date (Note) -
Abandoned
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Abstract
An apparatus for treating a wafer-shaped article, comprises a spin chuck for holding a wafer-shaped article in a predetermined orientation, a liquid dispenser for dispensing a treatment liquid onto a downwardly facing surface of a wafer-shaped article when positioned on the spin chuck, and a gas dispenser for dispensing a gas within a gap defined between the downwardly-facing surface of the wafer-shaped article and an upper surface of the spin chuck.
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