Mold-Tool Assembly Including Constant-Temperature Heater Assembly for Manifold Assembly
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United States of America Patent
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Issued Date -
Nov 21, 2013
app pub date -
Sep 20, 2011
filing date -
Sep 23, 2010
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Abandoned
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Abstract
A mold-tool assembly (100), comprising: a manifold assembly (102); and a constant-temperature heater assembly (99) being positioned relative to the manifold assembly (102), the constant-temperature heater assembly (99) being configured to convey, in use, a thermal-management fluid (109).
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