Chip array structure for laser diodes and packaging device for the same
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United States of America Patent
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Issued Date -
Nov 21, 2013
app pub date -
Jul 11, 2012
filing date -
May 18, 2012
priority date (Note) -
Abandoned
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Abstract
A chip array structure for laser diodes, formed on an active surface of a semiconductor chip produced from a semiconductor process includes a plurality of light-emitting elements in an array arrangement, at least one insulation wall, at least two wire bond areas and a plurality of connection electrodes. The insulation wall separates the light-emitting elements into at least two light-emitting districts. The wire bond areas are positioned respective to the corresponding light-emitting districts. The connection electrodes electrically couple the wire bond areas with the corresponding light-emitting districts. The wire bond areas have independent electrodes, and the light-emitting districts are electrically isolated by the insulation wall.
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