IMAGE-SENSING MODULE FOR REDUCING ITS WHOLE THICKNESS
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United States of America Patent
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Issued Date -
Nov 21, 2013
app pub date -
Jun 23, 2012
filing date -
May 16, 2012
priority date (Note) -
Abandoned
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Abstract
An image-sensing module for reducing its whole thickness includes a substrate unit, a carrier unit, an image-sensing unit and a lens unit. The substrate unit includes a substrate body and a through opening passing through the substrate body. The carrier unit includes a carrier body disposed on the bottom surface of the substrate body and corresponding to the through opening. The image-sensing unit includes an image-sensing element disposed on the top surface of the carrier body and embedded in the through opening. The lens unit includes an opaque frame disposed on the top surface of the carrier body to surround the image-sensing element and a lens connected to the opaque frame and positioned above the image-sensing element. Hence, the whole thickness of the image-sensing module can be reduced due to the design of placing the substrate body, the image-sensing element and the opaque frame on the carrier body.
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