MICROSTRUCTURE FOR FUSION BONDED THERMOPLASTIC POLYMER MATERIAL, AND RELATED METHODS
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United States of America Patent
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Issued Date -
Nov 14, 2013
app pub date -
Jan 27, 2012
filing date -
Jan 27, 2011
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Abstract
A material comprises a first layer that includes a thermoplastic polymer having a microstructure that includes a plurality of closed cells, each cell containing a void and each cell having a maximum dimension extending across the void within the cell that ranges between 1 micrometer and 200 micrometers long. The material also includes a second layer including a thermoplastic polymer having a microstructure that includes a plurality of closed cells, each cell containing a void and each cell having a maximum dimension extending across the void within the cell that ranges between 1 micrometer and 200 micrometers long. The material also includes an interface layer formed by fusion bonding the first layer to the second layer, the interface layer having a microstructure that includes a plurality of closed cells, each cell containing a void and each cell having a maximum dimension extending across the void within the cell that is at least 100 micrometers long.
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