MATERIAL STORAGE AND DISPENSING PACKAGES AND METHODS
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United States of America Patent
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Issued Date -
Nov 14, 2013
app pub date -
Apr 1, 2013
filing date -
Apr 25, 2005
priority date (Note) -
Abandoned
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Abstract
Packages and methods for storage and dispensing of materials, e.g., high purity liquid reagents and chemical mechanical polishing compositions used in the manufacture of microelectronic device products, including containment structures and methods adapted for pressure-dispensing of high-purity liquids. Liner packaging of liquid or liquid-containing media is described, in which zero or near-zero head space conformations are employed to minimize adverse effects of particle generation, formation of bubbles and degradation of contained material.
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