HEAT SINK FOR AN ELECTRONIC COMPONENT
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Nov 14, 2013
app pub date -
Mar 15, 2013
filing date -
Mar 22, 2012
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A device for thermal management of an electronic component includes an inner shell dimensioned to house an electrical circuit and a thermally conductive metal outer shell. The metal outer shell has a thickness less than 6.3246 mm; a first closed end having a first diameter and dimensioned to support an electronic component operably connected to the electrical circuit; and a second end having a second diameter, wherein the first diameter is greater than the second diameter. The inner shell is at least partially within the outer shell. The outer shell is comprised of a single metal sheet. The thinnest portion of the outer metal shell is less than or equal to 0.75 times the thickest portion of the outer metal shell.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully