NEW PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME
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United States of America Patent
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Issued Date -
Nov 14, 2013
app pub date -
Nov 4, 2011
filing date -
Nov 5, 2010
priority date (Note) -
Abandoned
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Abstract
The present invention relates to a laminated body for forming a printed circuit board comprising: a separation member in which first conductive layers and second conductive layers separable from each other are sequentially provided on each of upper and lower surfaces of a separating-insulation member; a laminating-insulation member sequentially laminated on each of the upper and lower surfaces of the separation member; and a conductive layer sequentially laminated on each of upper and lower surfaces of the insulation member, a printed circuit board comprising the laminated body, and a method of manufacturing the same. The present invention provides the new multi-layer printed circuit board to which various designs, such as a double-sided structure or an unbalanced structure, are applicable while overcoming an application limitation of a single-sided printed circuit board structure in the related art, thereby improving productivity and economic feasibility.
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