ELECTROLESS COPPER PLATING BATH AND ELECTROLESS COPPER PLATING METHOD
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United States of America Patent
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Issued Date -
Nov 7, 2013
app pub date -
Dec 28, 2012
filing date -
May 7, 2012
priority date (Note) -
Abandoned
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Abstract
Provided are an electroless copper plating bath and an electroless copper plating method using the electroless copper plating bath, the electroless copper plating bath not containing formaldehyde; being usable under approximately neutral pH conditions; improving plating bath stability; and capable of forming a plating film with a good thickness while controlling deposition outside a pattern. The electroless copper plating bath according to the present invention contains a water-soluble copper salt, and amine borane or a substituted derivative thereof as a reducing agent; does not contain formaldehyde; and has a pH of 4 to 9, wherein polyaminopolyphosphonic acid as a complexing agent, an anionic surface-active agent, an antimony compound, and a nitrogen-containing aromatic compound are contained.
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