UICC ENCAPSULATED IN PRINTED CIRCUIT BOARD OF WIRELESS TERMINAL
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United States of America Patent
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Issued Date -
Nov 7, 2013
app pub date -
May 3, 2013
filing date -
May 4, 2012
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A multilayer circuit board of a wireless terminal, a circuit assembly comprising the circuit board and a wireless terminal comprising the circuit assembly are provided. The wireless terminal is of a type which utilizes a UICC. The multilayer circuit board is configured to accommodate a UICC encapsulated within one or more interior layers of the multilayer circuit board, for example as a semiconductor die. The multilayer circuit board is further configured to accommodate one or more additional components integral to functionality of the wireless terminal, optionally also embedded within the circuit board. Integration of components into the interior layers may facilitate theft deterrence and/or tamper resistance. A physical programming interface to the encapsulated UICC may be rendered inaccessible after initial programming.
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