SOLDER SHEET AND SMOLDERING METHOD USING THE SAME
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United States of America Patent
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Issued Date -
Nov 7, 2013
app pub date -
Jul 20, 2012
filing date -
May 3, 2012
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
Disclosed herein are a solder sheet and a soldering method using the same. The solder sheet includes: a plurality of solder rods arranged to have a uniform height h and an area density N; and a support having an adhesive formed on one surface thereof and supporting the plurality of solder rods such that one end of each of the plurality of solder rods is attached to be perpendicular to the surface on which the adhesive is formed. Solder bumps can be formed on soldering portions of the substrate by using the solder sheet through a single process without a mask, and thus, the process can be simplified, costs can be reduced, and a defect rate can be lowered, thereby enhancing reliability.
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