CIRCUIT BOARD
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United States of America Patent
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Issued Date -
Nov 7, 2013
app pub date -
May 3, 2013
filing date -
May 3, 2012
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A circuit board is provided. The circuit board is suitable for carrying a chip. The circuit board includes a dielectric layer and a first circuit layer. The first circuit layer is disposed on a first side of the dielectric layer. The first circuit layer includes a first pad and a plurality of second pads surrounding the first pad. The chip is substantially located above the first pad, and the second pads are suitable for connecting the chip, wherein at least one of the second pads has a tip pointing toward the first pad.
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