DEVICE FOR CHARACTERIZING THE MECHANICAL PROPERTIES OF A MATERIAL WITH A LOW MODULUS OF ELASTICITY
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Nov 7, 2013
app pub date -
Nov 8, 2011
filing date -
Nov 15, 2010
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
The present invention relates to a device for characterizing mechanical properties of a material (S) with a low modulus of elasticity, comprising an application surface (3) and a mechanical stressing mechanism (5), said mechanical stressing mechanism comprising: a mobile indenter (6) that can move at least in vertical translation so as to bear substantially normally on said material and on said application surface (3), at least one means (14) for translating said indenter along a vertical axis Z-Z′ from a reference position in which the indenter is not in contact with the material (S) and at least one sensor (11) for measuring the load applied by the indenter on the material (S) along a direction normal to the application surface on the material, and at least one position sensor (20) able to determine the vertical position of said indenter (6) with respect to said reference position.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully