METHOD FOR SEPARATING A PRODUCT SUBSTRATE FROM A CARRIER SUBSTRATE
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United States of America Patent
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Issued Date -
Oct 31, 2013
app pub date -
Jan 17, 2011
filing date -
Jan 17, 2011
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Abandoned
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Abstract
The invention relates to a method for stripping a product substrate from a carrier substrate which is connected to the product substrate by an interconnect layer with the following steps, especially the following sequence:
- application of solvents to one flat side of the carrier substrate facing away from the interconnect layer,flow of a throughflow portion of the solvent through the carrier substrate,at least partial detachment of the interconnect layer, predominantly by the throughflow portion andstripping of the product substrate from the carrier substrate.
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