METHOD FOR FABRICATING SEMICONDUCTOR DEVICE
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United States of America Patent
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Issued Date -
Oct 31, 2013
app pub date -
Apr 29, 2013
filing date -
Apr 27, 2012
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Abandoned
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Abstract
A method for fabricating a semiconductor device includes: forming a first layer and a second layer in this order on a nitride semiconductor layer on a first main surface side of a substrate, the first and second layers having one of first and second arrangements, the first arrangement having the first layer of any of Au, V and Ta and the second layer of Ni, the second arrangement having the first layer of any of Ti, TiW, Al, W, Mo, Nb, Pt, Ta and V and the second layer of Au; forming a mask on a second main surface side of the substrate, the mask having an opening; applying an etching process to the substrate and the nitride semiconductor layer exposed in the opening of the mask; and determining an endpoint of the etching process by confirming elimination of the first layer in the opening of the mask.
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