ELECTROLESS PLATING DEVICE AND ELECTROLESS PLATING METHOD
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United States of America Patent
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Issued Date -
Oct 31, 2013
app pub date -
Jul 16, 2012
filing date -
Apr 26, 2012
priority date (Note) -
Abandoned
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Abstract
There is provided an electroless plating device including: a plating bath having a plating solution contained therein; a circulation unit connected to the plating bath and circulating the plating solution contained in the plating bath; an additive supply unit mounted on the circulation unit and supplying an additive for extracting carbonate included in the plating solution; and a filter unit mounted on the circulation unit and filtering the extracted carbonate through a reaction with the additive.
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