WATER-COOLING THERMAL DISSIPATING SYSTEM, THERMAL DISSIPATIING METHOD THEREOF, AND FIRMWARE UPDATING METHOD THEREOF
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United States of America Patent
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Issued Date -
Oct 24, 2013
app pub date -
Mar 18, 2013
filing date -
Apr 23, 2012
priority date (Note) -
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status (Latency Note)
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Abstract
A water-cooling thermal dissipation system is connected to an electronic device for dissipating heat generated by a thermal generating member. The electronic device includes a motherboard where the heat generating member disposed. The water-cooling heat dissipation system includes at least one thermal-cycling loop, a controlling module, and a connecting member. A cooling liquid of the thermal-cycling loop flows in at least one pump and at least one thermal exchanger through a plurality pipes. The controlling module is electrically connected to the thermal-cycling loop and monitors the operating temperatures of the thermal generating member and the cooling liquid, and outputs a warning signal when one of operation temperatures of the thermal generating member and the cooling liquid is higher than a predetermined value. The connecting member is connected to the controlling module and the motherboard, so that signals can transmit between the controlling module and the motherboard.
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- 12 Age