METHOD OF PATTERING NONMETAL CONDUCTIVE LAYER
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United States of America Patent
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Issued Date -
Oct 24, 2013
app pub date -
Aug 22, 2012
filing date -
Apr 20, 2012
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Abandoned
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Abstract
A method of patterning a nonmetal conductive layer on a circuit board is provided. A nonmetal conductive layer and a negative photoresist layer are sequentially formed on a substrate of a circuit board. Then, the negative photoresist layer is exposed through a patterned photomask and then developed by a developing solution. Next, the nonmetal conductive layer is etched. The remained photoresist layer is finally removed by a non-alkaline stripper solution to obtain a patterned nonmetal layer on the substrate.
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