Mask and method for forming the same

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United States of America Patent

PATENT NO 8974988
SERIAL NO

13451767

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Abstract

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A photomask includes a low thermal expansion material (LTEM) substrate, a patterned opaque layer over the LTEM substrate, and a patterned capping layer over the opaque layer. The patterned capping layer includes a transition metal material for suppressing haze growth, such as metal oxide, metal nitride, or metal oxynitride. The material in the capping layer reacts with a hydrogenic compound from a lithography environment to for an atomic level hydrogen passivation layer. The passivation layer has superior ability to suppress photo-induced haze defect growth on the photomask surface, to improve production cycle time and reduce the production cost.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD8 LI-HSIN RD 6 HSINCHU SCIENCE PARK HSINCHU 300-78

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Chia-Jen Jhudong Township, Hsinchu County, TW 98 1413
Lee, Hsin-Chang Hsin-Chu Xian, TW 203 1090
Lien, Ta-Cheng Cyonglin Township, Hsinchu County, TW 104 198
Lin, Yun-Yue Hsinchu, TW 77 363
Yen, Anthony Zhubei, TW 157 3414

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