Adhesion Promotion of Vapor Deposited Films
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United States of America Patent
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Issued Date -
Oct 24, 2013
app pub date -
Apr 3, 2013
filing date -
Apr 3, 2012
priority date (Note) -
Abandoned
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Abstract
Methods for improving the adhesion of vacuum deposited coatings to a wide variety of substrates are described herein. The methods include utilizing a thermal source to generate free radical species which are then contacted to the substrate to be coated. Chemical vapor deposition, particularly initiated chemical vapor deposition (iCVD) can be used to form polymer thin films in situ without the need to remove the substrate from the chamber or even return to atmospheric pressure. Significant improvements in substrate adhesion of the subsequently deposited films have been observed over a range of substrate and coating materials.
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