ELECTRONIC DEVICE
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United States of America Patent
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Issued Date -
Oct 24, 2013
app pub date -
Apr 9, 2013
filing date -
Apr 24, 2012
priority date (Note) -
Abandoned
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Abstract
An electronic device includes a substrate and an electronic component. The substrate has a metallization trace. The metallization trace has a metallization layer and a synthetic resin layer. The metallization layer has a high-melting-point metallic component and a low-melting-point metallic component. The high-melting-point metallic component and the low-melting-point metallic component are diffusion bonded together and adhered to a surface of the substrate. The synthetic resin layer is formed simultaneously with the metallization layer to cover a surface of the metallization layer with a thickness in the range of 5 nm to 1000 nm. The electronic component is electrically connected to the metallization layer.
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