DUAL SUBSTRATE DEVICE AND DUAL SUBSTRATE BONDING METHOD
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Oct 17, 2013
app pub date -
Mar 29, 2013
filing date -
Apr 12, 2012
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Loading Importance Indicators... 
Abstract
A dual substrate device includes a first substrate, a second substrate and a first sealant. The first sealant is located between and around the first substrate and the second substrate. The first sealant has at least two wide widths so as to enhance peeling strength of the dual substrate device.
Loading the Abstract Image...
OK
First Claim
Family
Loading Family data...
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully