RETAINING SYSTEM FOR RETAINING AND HOLDING A WAFER
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United States of America Patent
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Issued Date -
Oct 17, 2013
app pub date -
Dec 14, 2010
filing date -
Dec 14, 2010
priority date (Note) -
Abandoned
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Abstract
This invention relates to a retaining system for retaining and holding a wafer for processing the wafer with a holding surface for placing the wafer on a support surface of the wafer and holding means for holding the wafer, whereby because of the holding means holding extremely thin wafers on the holding surface of the wafer, the smallest possible local distortions of the wafer are achieved.
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