Epoxy Resin Composition, and Prepreg and Copper Clad Laminate Made Therefrom
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United States of America Patent
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Issued Date -
Oct 10, 2013
app pub date -
Mar 15, 2013
filing date -
Apr 5, 2012
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Abstract
The present invention relates to an epoxy resin composition, and a prepreg and a copper clad laminate made therefrom. The epoxy resin composition comprises the following essential components: (A) at least an epoxy resin, of which the melt viscosity is not more than 0.5 Pa·s under the temperature of 150 ° C.; (B) phenolic resin, of which the structure is as shown in the formula 1:
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