METAL NANOPARTICLE PASTE, ELECTRONIC COMPONENT ASSEMBLY USING METAL NANOPARTICLE PASTE, LED MODULE, AND METHOD FOR FORMING CIRCUIT FOR PRINTED WIRING BOARD
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United States of America Patent
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Issued Date -
Oct 10, 2013
app pub date -
Jun 2, 2011
filing date -
Jun 16, 2010
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Abandoned
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Abstract
Disclosed is a metal nanoparticle paste that uses the low-temperature sintering characteristics of metal nanoparticles to easily obtain a metal bond with excellent conductivity and mechanical strength, and which can form a wiring pattern with excellent conductivity. The metal nanoparticle paste is characterized by containing (A) metal nanoparticles, (B) a protective film that coats the surface of the metal nanoparticles, (C) a carboxylic acid, and (D) a dispersion medium.
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