SYSTEM PROVIDED WITH A SOLDER JOINT
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United States of America Patent
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Issued Date -
Oct 10, 2013
app pub date -
Mar 27, 2013
filing date -
Apr 4, 2012
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A system provided with a solder joint includes: a circuit board (101) provided with an aperture (102), an electrical component (103) including a conductor foot (104) protruding through the aperture, and soldering metal (105) inside the aperture and in contact with the conductor foot. The system further includes a thermal conductor element (106) including a first portion outside the aperture and a second portion inside the aperture and in contact with the soldering metal. The thermal conductor element is capable of conducting heat and thereby it intensifies the heat transfer into the aperture during pre-heating which precedes the process phase when the molten soldering metal is enabled to be absorbed into the aperture. Thus the reliability of the solder joint is improved, i.e. a risk of a faulty “cold” solder is decreased.
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