APPARATUS AND METHOD FOR LIQUID TREATMENT OF WAFER-SHAPED ARTICLES
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United States of America Patent
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Issued Date -
Oct 3, 2013
app pub date -
Mar 30, 2012
filing date -
Mar 30, 2012
priority date (Note) -
Published
status (Latency Note)
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Abstract
An apparatus and method for liquid treatment of wafer-shaped articles comprises a process unit comprising a chuck for holding a wafer-shaped article in a predetermined orientation, and a liquid recovery system that receives used process liquid recovered from the process unit. The liquid recovery system supplies process liquid to a dispenser in the process unit. A supply of fresh process liquid supplies fresh process liquid to the liquid recovery system and also supplies fresh process liquid to a dispenser in the process unit while bypassing the liquid recovery system.
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International Classification(s)
- 2012 Application Filing Year
- H01L Class
- 20465 Applications Filed
- 18077 Patents Issued To-Date
- 88.34 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 9 Citation Count
- H01L Class
- 4.91 % this patent is cited more than
- 12 Age