APPARATUS AND METHOD FOR LIQUID TREATMENT OF WAFER-SHAPED ARTICLES
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United States of America Patent
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Oct 3, 2013
app pub date -
Mar 30, 2012
filing date -
Mar 30, 2012
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Abstract
An apparatus and method for liquid treatment of wafer-shaped articles comprises a process unit comprising a chuck for holding a wafer-shaped article in a predetermined orientation, and a liquid recovery system that receives used process liquid recovered from the process unit. The liquid recovery system supplies process liquid to a dispenser in the process unit. A supply of fresh process liquid supplies fresh process liquid to the liquid recovery system and also supplies fresh process liquid to a dispenser in the process unit while bypassing the liquid recovery system.
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