COMPONENT HOLE TREATMENT PROCESS AND AEROSPACE COMPONENT WITH TREATED HOLES

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United States of America Patent

APP PUB NO 20130260168A1
SERIAL NO

13434320

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Abstract

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A method of treating a hole in a metallic component includes the following steps in sequence: forming an hole having a first diameter in the component; expanding the hole to a second diameter using a cold expansion process, so as to induce residual compressive stresses in the material surrounding the hole; shot peening the hole; and final machining the hole to a finished diameter.

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Patent Owner(s)

Patent OwnerAddress
GENERAL ELECTRIC COMPANY1 RIVER ROAD SCHENECTADY NY 12345

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Geverdt, Gerald Roger Cincinnati, US 6 67
Lawless, Bernard Harold West Chester, US 3 46
Slavik, Donald Charles Cincinnati, US 4 46
Van, Stone Robert Hugh Cincinnati, US 2 66

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