RESIN COMPOSITION, AND PREPREG AND LAMINATE USING SAME
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United States of America Patent
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Issued Date -
Oct 3, 2013
app pub date -
Oct 19, 2011
filing date -
Oct 29, 2010
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Abandoned
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Abstract
A resin composition having high Tg (high heat resistance), low thermal expansion, and excellent flame retardancy, and being advantageous for promoting halogen-free, and having excellent adhesiveness with Cu, a prepreg obtained by impregnating it into substrate, and a composite and a laminate obtained from them. Specifically provided are a modified polyimide resin composition containing (A) a polymaleimide compound of formula [1], (B) epoxy resin having at least two glycidyl groups in the molecule of formula [2], and (c) phenolic compound having at least two OH groups in the molecule, and a prepreg obtained by impregnating the composition into the substrate, and a composite and a laminate obtained from the prepreg.
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