ELECTRONIC DEVICES
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United States of America Patent
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app pub date -
Feb 11, 2013
filing date -
Dec 14, 2002
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Abstract
A method for forming an electronic device having a multilayer structure, comprising: embossing a surface of a substrate so as to depress first and second regions of the substrate relative to at least a third region of the substrate; depositing conductive or semiconductive material from solution onto the first and second regions of the substrate so as to form a first electrode on the first region and a second electrode on the second region, wherein the electrodes are electrically insulated from each other by the third region.
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