HEAT DISSIPATION APPARATUS FOR ELECTRONIC DEVICE
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United States of America Patent
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Issued Date -
Oct 3, 2013
app pub date -
May 18, 2012
filing date -
Mar 28, 2012
priority date (Note) -
Abandoned
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Abstract
A heat dissipation apparatus adapted for cooling an electronic component received in a metal housing includes a heat sink thermally attached to the electronic component and plural of resilient tabs arranged between the heat sink and the metal housing. The resilient tabs are elastically deformed by the metal housing and thermally contact an inner face of the metal housing.
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