CAPACITIVE TOUCH SCREEN AND MANUFACTURING METHOD THEREOF
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United States of America Patent
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Issued Date -
Oct 3, 2013
app pub date -
Aug 15, 2012
filing date -
Mar 30, 2012
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Abandoned
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Abstract
The invention relates to a capacitive touch screen and a manufacturing method thereof, wherein a touch chip does not need package test and only needs a chip wafer. Therefore, compared with the traditional touch chip for a touch screen module, the package cost and the package test cost of the chip are reduced. Meanwhile, due to small area of the chip, the amount of space is small compared with the traditional touch chip with a package outline. The invention has the advantages that: the overall material cost of the capacitive touch screen can be effectively reduced; the capacitive touch screen is easy to produce; the requirements on the manufacturing processes of the capacitive touch screen are reduced; and the product yield is improved.
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